Sleek Ball-Bump ESP32-S3-N16R8 Enclosure v 3
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Description
A sleek, modern shell for the ESP32-S3-N16R8 dev board, built around a snap-fit lid instead of screws or hooks. Rounded vertical corners and 2.5 mm walls give it a clean, finished look, while the lid's four ball bumps click into shallow dimples in the long walls: self-centering, no visible hardware, and no layer-line hooks to snap off. A shared counterbore around the USB-C ports lets bulky cable overmolds seat flush against the wall, so the board sits low and the cable still plugs in fully. The lid now carries two cantilever button tongues, and the body is opened underneath for pins from below.
Design notes
- Board fit: internal cavity of 69.8 × 26.2 × 10.25 mm, with about 0.4 mm clearance per side on a 69 × 25.5 mm board. The long rails are now short pads at each end, and overall height is about 12.3 mm.
- USB-C access: two 9.8 × 3.8 mm cutouts with 0.5 mm rounded corners, separated by a 3 mm strut on the short wall. A single 25.6 × 7 mm counterbore, 1.2 mm deep, wraps both openings so overmolded plugs clear; the strut stays at full depth behind it to keep the board edge captive.
- Lid and buttons: 2 mm plate with an inner lip; four 0.8 mm ball bumps engage shallow dimples with about 0.5 mm engagement and 0.3 mm interference. Each cantilever button is a tongue cut free of the lid plate by a U-shaped slot, thinned to 0.7 mm, with a 2.4 mm nub under the free end to press the board button. The old plain button holes are gone; the two 3 mm LED holes remain. Button positions are estimated rather than measured, so check them against your board variant before printing.
- Bottom pin access: two 50 × 3 mm slots run through the floor under the header rows, 22.86 mm apart, so pins can pass through from the bottom.
- Printing: the shell and lid are separate pieces, sized for PETG. They are laid out side by side on the plate, not stacked, within about 74.8 × 70.4 × 12.3 mm.
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